Dynamic chemical plating has been developed to overcome the disadvantages of conventional electroless plating (plating bath control, solution life limitation, difficult plating for large products, plating rate around 5㎛, etc.). Dynamic chemical plating can be employed for single metal plating such as copper, nickel and silver as well as alloy plating including Ni-P and Ni-B-P, and composite plating including Ni-B-P-graphene composite coating. Silver coating layers by the dynamic chemical plating are widely used for silver mirrors, electromagnetic shielding, and consumer goods production.
Ri Ju Chon, a researcher at the Faculty of Chemical Engineering, has experimentally studied the effect of silver concentration, ammonia water concentration, formaldehyde concentration, pH and temperature on the plating rate of dynamic chemical plating, and derived a relationship equation between each parameter and the rate by least squares approximation.
As the relative error between actual measured rate and calculated rate using the equation is less than 15%, the rate equation is considered useful for controlling plating process and clad thickness.
For further details, you can refer to his paper “Derivation of the Rate Equation of Silver Plating by Dynamic Chemical Plating” in “Proceedings of KUTIC-2025”.