It is very important to improve the quality of communication lines.
Communication lines, that is, telephone lines should have not only high electrical conductivity but also high strength.
The use of copper-coated wires with low resistivity as communication wires has become a worldwide trend.
The wire used for communication should have a low wire resistance, as well as a good current flow, and a limited diameter wire should be coated with a copper deposit of a certain thickness.
Therefore, the crystal should be compact and the thickness should be uniform.
The wire used as a telephone wire is very thin with the diameter of 0.235-0.24 mm, so it cannot be used at high temperatures and it must have a certain thickness to obtain appropriate resistivity. If it is too thin or too thick, its resistivity increases.
Kim Kyong Chol, a section head at the Faculty of Chemical Engineering Faculty, has designed and established a high-speed continuous copper coating process for producing wire by depositing copper of uniform thickness on the surface of a steel wire by the electroplating method at the time of continuous draw of steel wire.
To ensure the copper plating layer thickness of 0.015mm on the steel wire, he set the plating process in two stages and fixed the anode contact at 2m intervals, and carried out degreasing, neutralization, plating and passivation continuously.
For constant immersion length in the plating solution, he set the reciprocating of wire to be 1.5 times.
When the number of outgoing wires is 6 and the outgoing speed is 10~15m/min, the resistance value of the steel wire copper coating is 1.6~2Ω/m, and the resistivity is 0.08~0.1Ω·mm2/m.
The proposed method is widely used in the units for copper plating of 0.2-0.5mm steel wire, especially in the plants for producing copper coating steel wire for communication.
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